集成电路工艺原理第七章 离子注入原理 (上)INFO130024.01集成电路工艺原理 仇志军zjqiufudan.edu邯郸校区物理楼435室1大纲 第一章 前言第二章 晶体生长第三章 实验室净化及硅片清洗第四章 光刻第五章 热氧化第六章 热扩散第七章 离子注入第八章 薄膜淀积第九章 刻蚀第十章
单击此处编辑母版标题样式单击此处编辑母版文本样式第二级第三级第四级第五级VLSI课程习题课 —HSPICE介绍1ContentsEDA工具和HSPICE历史1HSPICE的使用介绍2HSPICE的安装3习题简介42IC EDA 工具厂商 CadenceMentor GraphicsSynopsys...IC EDA 应用软件设计输入
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