单击此处编辑母版标题样式单击此处编辑母版文本样式第二级第三级第四级第五级单击此处编辑母版标题样式单击此处编辑母版文本样式第二级第三级第四级第五级Wafer Bonding Thinning and Handling for 3-D IC IntegrationWang Ziqing2010-02-04 Three-dimensional (3-D) wafer stacking technol

??On Effective and Efficient In-Field TSV Repair for Stacked 3D ICsPresenter: Li JiangLi Jiang? Fangming Ye Qiang Xu? Krishnendu Chakrabarty and Bill Eklow§?CUhk REliableputing LaboratoryThe Chi