按一下以編輯母片標題樣式按一下以編輯母片第二層第三層第四層第五層System in PackageIntegral Substrate MEMS 3D Package O-E Package EOCB Green Packaging System-in-a-PackageBuilt-in CBuilt-in RBuilt-in LGNDWave guideVccZ-connectionBuil
3D封装技术解决芯片封装日益缩小的挑战2010-8-13 :Roger Allan Electronic Design 来源: 半导体国际 HYPERLINK :.sichinamag.netviemomenmentListExt.htmsite=newsarticleId=22232 t _blank 我要评论(0) 核心提示:随着芯片