STD - World-Wide StandardGeneral MPQ for SpeakersMPQ-774179-0000DWWP - World-Wide PolicyFor SiteRegion: All SitesRegionsFor NEW speaker project or re-design packaging product Revision history:RevD

ASIC : Flip Chip ?Flip-chip packaging enables the creation of high-pinout high-speed designs that are not achievable in a standard wirebond packaging techniques connect die bond pads to a package

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PRODUCT PACKAGING STANDARDS GUIDELINES FOR CHEMICAL ANALYSIS- 11 - Description of Product on Shipping Container The intent of this requirement is to allow for easy recognition of the product w