PREPARED BY : RAYMOND CHENG OSCAR FENG KENNY CHUAN HERMAN KUOISSUE DATE : APRIL 161998A080 WIRE BOND (WB) 初 級 訓 練 教 材壹?WIRE BOND 的意義貳?WIRE BOND 機台與材料介紹參?WIRE BO
Eagle?WCDMA?Pilot?Indoor?Transmitter和Eagle?WCDMA?Receiver整体解决方案Eagle?WCDMA?Pilot?Indoor?Transmitter可以模拟一个标准的?Mbits带宽(总带宽为5?Mbits有效带宽为?Mbits)的WCDMA信号进行发射该信号包含CPICHSCH等信息的调制信号Eagle?WCDMA?Receive可以对WCDMA
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Chapter 8Results PostprocessingChapter OverviewIn this chapter, aspects of reviewing results will be covered:Viewing ResultsScoping ResultsExporting ResultsCoordinate Systems & Directional ResultsSo
Chapter 9CAD & ParametersChapter OverviewIn this chapter, interoperability with CAD software as well as parameters will be discussedCAD InteroperabilityDesignXplorer Parameter ManagerWorkshop 9-1The
Chapter 2Mechanical BasicsChapter OverviewIn this chapter, the basics of using Mechanical to perform analyses will be covered, which include:The Mechanical GUI and OperationIntroduction to the Mecha
Chapter 7Linear Buckling AnalysisChapter OverviewIn this chapter, performing linear buckling analyses in Mechanical will be coveredContents:Background On BucklingBuckling Analysis ProcedureWorkshop
Chapter 3General PreprocessingChapter OverviewIn this chapter, using features without the use of the Wizards will be coveredTopics:GeometryContactWorkshop 3-1, “Contact Control”MeshingNamed Selectio
Chapter 6Thermal AnalysisChapter OverviewIn this chapter, performing steady-state thermal analyses in Simulation will be covered:GeometryAssemblies – Solid Body ContactHeat LoadsSolution OptionsResu
Table of ContentsInventory Number:0025931st EditionANSYS Release:120Published Date:May 5, 2009Registered Trademarks:ANSYS? is a registered trademark of SAS IP IncAll other product names mentioned in
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